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Electronics Technology

By Department of Defense

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Book Id: WPLBN0000068116
Format Type: PDF eBook
File Size: 0.4 MB
Reproduction Date: 2005
Full Text

Title: Electronics Technology  
Author: Department of Defense
Language: English
Subject: Military, Armed Forces., National defense.
Collections: Military and Armed Forces Library Collection
Publication Date:
Publisher: Department of Defense


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Defense, D. O. (n.d.). Electronics Technology. Retrieved from

Government Reference Publication

Excerpt: The array of technologies covered in Section 5.0 is related to Microelectronics (General Purpose. Integrated Circuits), Opto-Electronics, Electronic Components, General Purpose. Equipment, Fabrication Equipment, and Materials. Militarily critical technologies include materials and techniques that enable the extreme density and high performance, with low power, of Very Large Scale Integrated Circuits (VLSI), Ultra Large Scale Integrated Circuits (ULSI), and Very High-Speed Integrated Circuits (VHSIC). These technologies also include microwave/millimeter wave tubes, integrated circuits and devices, manufacturing equipment, and materials. Computer aided design, manufacturing and test (CAD/CAM/CAT) capabilities to turn out practical working systems in a timely and efficient manner are companion capabilities which must keep pace to allow the effective use of these critical technologies. The performance of processors and capacity of memory chips has doubled every 18 months since 1970. Other semiconductor chips have followed this pattern. This exponential growth is expected to continue until 2005. As the count of transistors on a chip continues to grow exponentially, the cost of building a top-of-the-line chip fabrication plant has also risen because of the higher costs associated with the increasingly exotic facilities and tools need to etch finer and finer lines on a chip. By that time, the price per transistor is expected to bottom out. Each new generation of chips will continue to produce a smaller return on investment and there will no longer be an economic incentive for making transistors smaller. The huge investment required for new fabrication plants will result in the realignment of today’s chip manufacturers. There are many joint ventures being formed between U.S. and Japanese to share the huge investment required for new fabrication plants. This trend is expected to continue and the end of some of today’s chip manufacturers is expected because there won’t be a business case for many new multi-billion dollar fabrication plants after 2005.

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